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Alloy 36 (36Ni-Fe) - UNS K93600 | Low Thermal Expansion Alloys
Alloy 36 (36Ni-Fe) - UNS K93600 | Low Thermal Expansion Alloys

Alloy 36 (36Ni-Fe) - UNS K93600 | Low Thermal Expansion Alloys

MOQ : 1 Piece

Alloy 36 (36Ni-Fe) - UNS K93600 | Low Thermal Expansion Alloys Specification

  • Application
  • Semiconductor Manufacturing Parts, Bimetals, Applications where dimensional changes due to heat are undesirable
  • Shape
  • Coil, Sheet
  • Temper
  • Annealed, Skin passed, As Rolled (Hard)
  • Chemical Composition
  • 36Ni-Fe
  • Width
  • Please contact us.
  • Grade
  • Alloy 36 (36Ni-Fe)
  • Thickness
  • Please contact us.
 

Alloy 36 (36Ni-Fe) - UNS K93600 | Low Thermal Expansion Alloys Trade Information

  • Minimum Order Quantity
  • 1 Piece
  • Payment Terms
  • Telegraphic Transfer (T/T)
  • Packaging Details
  • Our Standard Packing for Export
  • Main Domestic Market
  • North India
 

About Alloy 36 (36Ni-Fe) - UNS K93600 | Low Thermal Expansion Alloys

GradeAlloy 36 (36Ni-Fe)
Reference Standards (for reference only)UNS K93600
DIN 1.3912 (1715)
ShapeCoil, Sheet
ThicknessPlease contact us.
WidthPlease contact us.
LengthStrip or Sheet(Length less than 2,000mm)
TechniqueCold Rolled
TemperAnnealed, Skin passed, As Rolled(Hard)
ApplicationSemiconductor Manufacturing Parts, Bimetals, Applications where dimensional changes due to heat are undesirable
Coil I.D.300, 400, 565mm
Chemical Composition36Ni-Fe
Density8.11 g/cm
Thermal Expansion1.0-2.010/K (20100)
Thermal Conductivity10.0 W/(mK)25
Minimum Order QuantityPlease contact us.
Country of OriginJapan
Payment TermsTelegraphic Transfer (T/T)
Delivery TermsEXW, FOB, CIF, DAP etc.
Packaging DetailsOur Standard Packing for Export
Main Export Market(s)Asia, Muddle East, North America, South America, Europe etc.

Alloy 36 (36Ni-Fe) - UNS K93600 Description:

Alloy 36 (commonly known as Invar) is a nickel-iron alloy containing approximately 36% nickel.

It is characterized by an extremely low coefficient of thermal expansion, which significantly suppresses dimensional changes caused by temperature variations.

Because of this property, it is widely used in applications requiring high dimensional stability, precision components, and structures where thermal stress must be minimized.

Typical applications include semiconductor manufacturing parts, bimetal components, and precision assemblies where thermal stability is critical.

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